iPhone 8 disassembled. Technology news, video reviews, prices

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And now it's the turn of the 8 Plus. Is the implementation wireless charging sufficient parameter to distinguish the iPhone 8 Plus in the line? After the release of this model, users had many questions. Let's try to understand all the intricacies of a smartphone and study its components.

Step 1 – Disassembling the iPhone 8 Plus


Before we start the analysis, let's get a little familiar with the characteristics of the 8 Plus:

  • Apple A11 Bionic processor with built-in M11 motion coprocessor
  • 64 or 256 GB of internal memory
  • 5.5-inch multi-touch IPS Retina HD display with a resolution of 1920 × 1080 pixels (401 ppi)
  • Dual 12MP widescreen cameras with ƒ/1.8 and ƒ/2.8 apertures (respectively), optical zoom and 10x digital zoom
  • 7MP FaceTime HD camera with ƒ/2.2 aperture and 1080p HD recording
  • Support fast charging and Qi wireless charging
  • 802.11a/b/g/n/ac Wi-Fi + MIMO Bluetooth 5.0 + NFC module

Step 2




Other than the new color, the 8 Plus looks about the same as the 6 Plus from 2014.

Let's turn the smartphone over and see one new product that really shines. That glossy glass back serves two purposes: wireless charging and increased risk of breaking.

Apple designers decided to remove the model number from the back of the smartphone. Now it can be found on the box - our 8 Plus is listed under number A1864.

Step 3




In order not to wait a long time for analysis, we first looked inside the smartphone through an X-ray machine.

The presence of a charging coil on the back of the phone immediately catches your eye. But more on that later.

We can also see the improved TapticEngine vibration motor.

Step 4






Immediately we are greeted by the familiar Pentalobe screws at the bottom of the device.

The display is held very firmly on an adhesive base, so it needs to be warmed up a little using iOpener.

After warming up the device a little, we were able to open this iPhone.

Step 5



The battery connector has changed slightly. Just like in the iPhone 8, Apple did not use the awkward three-point screws and replaced them with Phillips #000 screws.

For easier extraction, four tabs are used, rather than two as before.

Taking a closer look at the battery, we see that it has characteristics of 3.82V, 2691 mAh, providing a power of 10.28 Wh.

Step 6






With just a few Phillips screws we were able to remove the display.

Looking ahead, the 8 and 8 Plus share the same Home button, meaning they'll be interchangeable.

We smoothly reached the camera module. These 12MP cameras are firmly secured together, allowing software, used in portrait mode, combine images from both lenses.

Step 7





We used the X-ray machine again.

The first image shows the ribbon cable under the camera's image sensors.

The last image shows the magnets used for OIS on only one of the two cameras.

Those missing magnets and landscape orientation are just another reminder that this is not an iPhone X.

Step 8



It's time motherboard.

It is attached using the same Phillips screws as in other iPhones.

Step 9




Let's see what's on the iPhone 8 Plus motherboard:

  • Secure NFC module NXP 80V18
  • Avago 8072JD112
  • Apple 339S00439 A11 BionicSoC overlays Samsung 3GB LPDDR4 RAM
  • P215 730N71T - probably tracking integrated board
  • Snapdragon X16 LTE Modulator Qualcomm MDM9655
  • Skyworks Sky One SKY78140
  • Skyworks 77366-17 quad-band power amplification component GSM signal

Step 10



And on the other hand we find the following:
  • Skyworks 3760 3759 1727 RF switch and SKY762-21 207839 1731 RF switch
  • Wi-Fi/Bluetooth device Murat 339S00399
  • NXP 1612A1. Probably a subtype of Tristar 1610 chip
  • Apple 338S00248, 338S00309 PMIC and S3830028
  • Qualcomm WTR5975 Gigabit LTE RF Transceiver and PMD9655 PMIC
  • SanDisk SDMPEGF12 64GB NAND Flash

Step 11




After removing the motherboard, we can remove some peripheral components. In particular, the speaker, the Taptic Engine and the barometric valve.

Step 12

Same as iPhone 8 new design This cable is designed to quickly dissipate heat during fast charging.

Step 13





After successfully removing the back panel from the iPhone 8, we decided to repeat the same procedure on this smartphone.

Warm up thoroughly back panel We carefully pryed up the body with plastic sticks. However, despite all the care, the panel immediately cracked. The glue Apple uses practically does not react to heat.

Step 14



And here is the result - a completely disassembled iPhone 8 Plus

Conclusion

The display and battery are removed first and without much effort – but the necessary skills are still needed.
Wireless charging means less wear and tear universal port Lighting.
The battery connector still uses regular Phillips/JIS fasteners, but you'll still need up to four different screwdrivers for many repairs.
Despite its supposed durability, the rear glass is very fragile and nearly impossible to replace.

If you need spare parts for the iPhone 8 Plus, you can check out our catalog or contact us in any way convenient for you.

Unlike many other manufacturers, Apple does not brag at presentations of new iPhone operational memory, battery and other components, limited only to the processor. iPhone 8 and iPhone 8 Plus, as expected, so the enthusiasts from iFixit were quick to reveal all the details.

Inside, the iPhone 8 is very similar to the iPhone 7, with the exception of the presence of a wireless charging coil and a smaller battery - now 1821 mAh versus 1960 mAh for the iPhone 7. This did not stop the new product from demonstrating the same time battery life, as the “seven” - here it’s worth saying thanks to the new A11 Bionic processor, which has become much more energy efficient.


Concerning random access memory, there are no changes here - the same 2 GB as in the iPhone 7. The battery, as experts noted, is secured with additional adhesive tape, and the Lightning port has become more secure.


Analysis of the iPhone 8 Plus showed that the smartphone also has minimal differences compared to. So, the device is mainly updated with a wireless charging coil and a smaller capacity battery - 2691 mAh. For comparison, the iPhone 7 Plus has a battery capacity of 2900 mAh. Experts also noted the new Lightning port mount: apparently it is . The amount of RAM has not changed - the same 3 GB.

Every year iFixit specialists sort out new iPhones to show us their internal structure and evaluate their maintainability. Last year's iPhone 7 received a score of 7 out of 10, repeating the result of its two predecessors - iPhone 6s and iPhone 6. However, this month and already on sale in some countries, the iPhone 8 failed to follow in its footsteps: for the difficult replacement of the six-layer rear glass and having to navigate some components through mounting brackets and carefully routed cables took one point away from him. The result is 6 out of 10, which is also not bad, if you remember the “one” for the Essential Phone and the “four” for Samsung Galaxy Note8.

Penetration into the insides of the G8 began with the removal of the front panel with the display. Having reached the battery, the disassemblers were convinced that its capacity had decreased slightly compared to the iPhone 7 and was now 1821 mAh (6.96 Wh) instead of the previous 1960 mAh (7.45 Wh).

The main camera retains the same 6-element lens with f/1.8 aperture, but its sensor, despite the same 12 megapixel resolution, is larger in size. This means it contains larger pixels that receive more light, resulting in better color reproduction and reduced noise, especially in low light conditions.

In the photo of the removed motherboard, the red square highlights the A11 Bionic single-chip system, under which is hidden a 2-GB LPDDR4 RAM module manufactured by SK Hynix. The small chip on the left is NFC module, on the right is the Qualcomm Snapdragon X16 LTE modem. The flash memory that Toshiba produces for the iPhone 8 is located on the back of the board (circled in a yellow frame in the photo below). In the upper right corner you can see the module responsible for transmitting data via Wi-Fi and Bluetooth, as well as receiving FM radio.

When all the other “stuffing” iPhone cases 8 is removed, the Qi wireless charging queue is approaching. The following photo clearly shows the module used to convert high-frequency oscillations of the magnetic field into alternating current. With more detailed description process of “dissection” of iPhone 8 on English language Can

How to disassemble iPhone 8

Apple has announced a line of new iPhone smartphones 8. Today we’ll look at all the features of the phone’s hardware and step by step actions, which will help you disassemble the gadget for subsequent repairs or replacement of parts.

iPhone 8 hardware features

The iPhone 8 has an A11 Bionic processor - new and this moment Apple's most productive development. Phone memory capacity is 64 GB or 256 GB. There is no specification for 128GB.

Display 4.7 inches with IPS multi-touch Retina HD matrix. The resolution is 1334 × 750 pixels (or 326 ppi). With the release of new Apple smartphone introduced modules for both cameras that were improved both at the software and hardware levels. The main camera is 12 MP. Supports optical image stabilization and 5x zoom. The front camera is 7 MP with HD support and the ability to shoot video in 1080p.

The phone supports fast charging technology and works with wireless devices for recharging. Connection technologies - Bluetooth 5.0, built-in NFC chip, Wi‑Fi. iPhone 8 supports Touch ID fingerprint scanner. Material back cover– impact-resistant glass.

List of required tools

Before you disassemble your iPhone 8, make sure you have all of the following parts:

  • Pentalobe P2 screwdriver;
  • Suction cup for detaching the display;
  • Phillips #000 screwdriver;
  • Tweezers;
  • Mediators;
  • Tri-point screwdriver Y000;
  • Spudger (plastic spatula for detaching cables);
  • iOpener.

Disassembling iPhone 8 - Instructions

Let's start disassembling the iPhone 8. First, take the iOpener - this is a special bag that retains heat and can quickly warm up the phone case for further opening. Without using this part, there is a high probability of damaging the gadget.

Warm up your gadget using iOpener:


Now take the suction cup and place it on the bottom area of ​​the display. Lift the back cover and begin to separate the screen from the hardware. Using picks, pry up all edges of the device, as shown in the figure below:


Open your phone as shown below. Do not remove the back cover completely as the cables are still connected to the display.


Take a Phillips #000 screwdriver and use it to remove the indicated motherboard cover. Remove the board and disconnect the cables connected to the display using a spudger. After this, set the display aside.


Take out the smartphone battery:


To remove the main camera module from the iPhone 8, disconnect its cable using a spudger. Next, take tweezers and carefully pick up the camera block as shown in the figure.




Disconnect the board:


iPhone 8 motherboard structure:

  • Purple color – NFC module;
  • Red – A11 CPU;
  • Orange - LTE modem;
  • Yellow - Skyworks SkyOne;
  • Green - Avago 8072JD130;
  • Blue – tracking system;
  • Blue – GSM module.

Using tweezers, remove the SIM card slot:


Using a screwdriver, disconnect all button mechanisms and their plugs from the inside of the back cover.


Remove the black tape. Under it there is a special adhesive tape that synchronizes the gadget with wireless charging.


Take tweezers and remove the rear button mechanism and the front camera/flash module.

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